Volume XXIX. Number 86. Modeling of materials for coupled problems (C)

(Edts. Eduardo N. Dvorkin, Marcela B. Goldschmit and Mario A. Storti)

Table of Contents

Articles

Numerical Study of the Effects of Bonding Layer Properties on Electrical Signatures of Piezoelectric Sensors
Hector A. Tinoco, Alberto L. Serpa, Angel M. Ramos
PDF
8391-8409
Design of Spark Plasma Sintering Graphite Die Using Topology Optimization
Flávio M. Vasconcelos, Luis A. M. Mello, Emílio C. N. Silva
PDF
8411-8420
Coupled Modeling of Shrinkage-Induce Microcracking in Heterogeneous Materials
Federico Antico, Pablo Zavattieri
PDF
8421-8421
Coupled Deformation and Solute Diffusion in Swelling Molecular Solids
Alberto Cuitino, Daniel Braido, Yuriy Gulak, Athanas Koynov
PDF
8423-8423
Effect of Thermal Cycles on Collapse Resistance of Cold-Formed Tubes
Santiago Serebrinsky
PDF
8425-8425