MEMS Sensors in Structural Health Monitoring: Applications with 3D-Printed Materials
DOI:
https://doi.org/10.70567/mc.v42.ocsid8460Palabras clave:
MEMS sensors, Acoustic Emission, Structural Health Monitoring, b-value analysis, Natural Time analysis, Crack propagationResumen
This study presents an acoustic emission (AE) monitoring strategy based on MEMS (Micro- Electro-Mechanical Systems) sensors applied to 3D-printed structures. AE data were analyzed using the b-value method to track damage development and Natural Time (NT) analysis to identify the onset of critical conditions. A comparison with a commercial piezoelectric sensor revealed similar performance, with both sensors detecting a reduction in the b-value preceding failure. MEMS sensors demonstrated an enhanced capacity to capture high-frequency signals. These results underline the potential of MEMS sensors as cost-effective tools for structural health monitoring in additive manufacturing contexts.
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Derechos de autor 2025 Asociación Argentina de Mecánica Computacional

Esta obra está bajo una licencia internacional Creative Commons Atribución 4.0.
Esta publicación es de acceso abierto diamante, sin ningún tipo de costo para los autores ni los lectores.
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