MEMS Sensors in Structural Health Monitoring: Applications with 3D-Printed Materials

Autores

  • Mariana Hamdan Padilha Universidade Federal do Pampa, Machines, Materials and Manufacturing Processes Research Group (GPMAT-PF). Alegrete, Brazil.
  • Maurício da Silveira Rudem Mombach Universidade Federal do Pampa, Machines, Materials and Manufacturing Processes Research Group (GPMAT-PF). Alegrete, Brazil.
  • Leandro Ferreira Friedrich Universidade Federal do Pampa, Machines, Materials and Manufacturing Processes Research Group (GPMAT-PF). Alegrete, Brazil.
  • Vicente Bergamini Puglia Universidade Federal do Pampa, Machines, Materials and Manufacturing Processes Research Group (GPMAT-PF). Alegrete, Brazil.
  • Mikael da Cruz Universidade Federal do Pampa, Machines, Materials and Manufacturing Processes Research Group (GPMAT-PF). Alegrete, Brazil.
  • Alessandro G. Girardi Universidade Federal do Pampa, Computer Architecture and Microelectronics Group (GAMA). Alegrete, Brazil.
  • Ignacio Iturrioz Universidade Federal do Rio Grande do Sul, Applied Mechanics Research Group (GMAP). Porto Alegre, Brazil.

DOI:

https://doi.org/10.70567/mc.v42.ocsid8460

Palavras-chave:

MEMS sensors, Acoustic Emission, Structural Health Monitoring, b-value analysis, Natural Time analysis, Crack propagation

Resumo

This study presents an acoustic emission (AE) monitoring strategy based on MEMS (Micro- Electro-Mechanical Systems) sensors applied to 3D-printed structures. AE data were analyzed using the b-value method to track damage development and Natural Time (NT) analysis to identify the onset of critical conditions. A comparison with a commercial piezoelectric sensor revealed similar performance, with both sensors detecting a reduction in the b-value preceding failure. MEMS sensors demonstrated an enhanced capacity to capture high-frequency signals. These results underline the potential of MEMS sensors as cost-effective tools for structural health monitoring in additive manufacturing contexts.

Referências

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Publicado

2025-12-03

Edição

Seção

Artigos completos da conferência MECOM 2025

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